I’ve commented on this subject from time to time but thought I’d have another go at it since the questions never seem to go away. I’m referring to the language used in our day-to-day work in measurement and calibration.
The electronics industry is driven by the trend for more GOPS (Giga-Operations per Second) per mm3. This requires smaller technology nodes in wafer manufacturing, a drive to advanced packaging, as well as back-end inspection of the smaller interfacing components like micro-bumps, distribution layers, etc.
Two interfaces—GigE and USB—have been dominating the machine vision industry for the last five years. One supports long cable lengths and easy integration of multiple cameras, while the other offers higher bandwidth and true plug-and-play convenience.
Test Equipment Distributors, LLC (TED), a nondestructive testing (NDT) distributor headquartered in Troy, MI, has acquired Centura Incorporated, a provider of both medical and NDT x-ray products and services.
Released in spring 2018, Allied Vision’s Bonito PRO is a new camera series combining high-resolution sensors with a high-bandwidth CoaXPress interface.
Teledyne DALSA introduced its newest Genie Nano cameras with eight new monochrome and color models built around the industry’s best performing SONY® image sensors. These industry-first 5-Gigabit GigE Vision cameras feature resolutions from 3.2Mpixels to 12Mpixels with more models to follow before the end of the year – including a 5Mpixel Polarized model.
Teledyne e2v announced the expansion of its Snappy family of image sensors with a new 5 Megapixel device. The SnappyTM 5M is designed for barcode reading, 2D scanning and other demanding applications.