NATICK, MA-Cognex Corp. has introduced a report titled, Direct Part Mark Considerations: Verification. This free report explains why the quality of a direct-marked 2-D code is so critical to the success of lifetime part traceability, and addresses how manufacturers can assess mark quality and control the marking process.
Hardness testing is being strongly affected by manufacturing’s demands for increased hardness accuracy, reduced labor and rapid feedback. Two approaches have emerged for achieving these goals: the automation of each aspect of existing test methods and the application of depth of indentation measurement techniques.
DURHAM, UK-Bede X-ray Metrology, a global provider of X-ray metrology systems to the semiconductor industry, announces that a new book titled “X-ray Metrology in Semiconductor Manufacturing” has just been published.
An X-Cube Compact radioscopic inspection system from GE Inspection Technologies (Huerth, Germany) has helped to optimize inspection workflow and reduce new product development times at BUVO Castings in the Netherlands while supporting the company’s underlying business philosophy of continually investing in state-of-the-art plant and machinery.