Integrating inspection and checklist apps with new AI object detection and classification skills reduces quality escapes and improves traceability for manufacturers.
The Industrial Metrology Business Unit of Nikon Corporation has released the automatic wafer measurement system NEXIV VMZ-NWL 200 to solve the challenges of wafer metrology in the semiconductor back-end process, where more work is traditionally carried out manually than in front-end process control.
The new RCS product line solves fundamental challenges within the global industrial automation industry. Puts focus on problems associated with manual set-up, calibration, and maintenance of robots, such as operational accuracy and repeatability.
LumeDEL LLC introduces the NewDEL™ Fiber-coupled LED sources that are designed to generate high radiant power with spectrally stable output and combining high performance with ease-of-use.
CAPTURE 3D, a ZEISS company, announced the ZEISS ATOS LRX—a new large-volume 3D scanning sensor with an ultra-bright laser light source that captures up to 2 × 12 million coordinate points with one scan, quickly delivering precise, full-field data from very large parts.