Solder Paste Inspection

The VP5000 in-line 3-D solder paste inspection system helps increase the throughput of 100% quality inspection of solder paste on printed circuit boards. The unit’s large field of view reduces the number of images required to inspect the board, reducing cycle time. Navigation through the system’s capabilities has been simplified by using tabbed menus in the touch screen interface to shorten inspection setup, operation monitoring and production changeover.

Capabilities such as the addition of warning thresholds to the pass/fail outputs allow for preventive action that reduces waste. The unit comes with an interface to proprietary software that enables the height calculation and volumetric inspection data to be incorporated into a root cause of failure analysis.

Omron Electronics LLC
(866) 88-OMRON
www.omron247.com

Looking for a reprint of this article?
From high-res PDFs to custom plaques, order your copy today!

Unlock the power of 3D measurement data to identify root causes, prevent dimensional issues, and gain actionable insights for quality assurance in this comprehensive 60-minute webinar.

Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, and WestPack — we are now merging 4 of these related industry sectors into a single unified show: MD&M West.

Our special focus on your specialty is not changing. One MD&M umbrella unites a community of multiple special interests who all share a single goal – to advance their knowledge, contacts, and progress in the rapidly accelerating world of advanced manufacturing.