Innovations in the electronics and semiconductor industries have birthed two relentless trends. Both profoundly impact both product designers and those charged with assuring that what was designed is what was manufactured. The trends are: higher densities for components, boards and processors, and the need for very high precision in the metal plating that enables functionality.

X-ray fluorescence is an elemental analysis tool that has been a mainstay of test labs for decades. A versatile NDT method that demands only minimal sample prep and can be run by novice operators, it is perhaps most valued for delivering accurate results quickly. Today, evolving XRF capabilities are moving this quality assurance workhorse into critical new roles in a widening spectrum of industries.