LUCID Vision Labs Inc. announced the series production of its new Helios™ Flex 3D Time-of-Flight module. Helios Flex is a robust, pre-calibrated Time-of-Flight MIPI module which can easily be integrated into embedded platforms for industrial and robotics applications. 

Three-dimensional (3D) imaging applications are used in many different industries ranging from both industrial pick and place, palletization/depalletization, warehouse, robotics and metrology applications to consumer-based products such as drones, safety and security, and patient monitoring applications.

3D imaging technology plays a powerful role in industrial applications. Depending on the application requirements, such as distance to target, level of accuracy and precision, environmental lighting, and overall costs, different 3D technologies will bring different advantages.

3D imaging means different things to different people. While 3D imaging has been around in some form for decades, technological advances have brought it to new applications, thanks in part to improvements in image sensors, standardization of interface technologies and increased demand for new solutions for more complex imaging needs.

Machine vision as a subset of computer science has been around for more than 20 years.